When upgrade the MP3 player, it can not be upgraded some times, the majority of such cases because there are redundant FLASH memory can not clear. the result is not possible to upgrade the firmware correctly written to the appropriate address, and the FLASH itself is not a hardware failure. This requires a special tool to clear the FLASH, you can re-upgrade.
FLASH checked and cleared devices commonly used, two basic functions of detection. One is the simple need to access a computer to operate the U disk FLASH empty plate frame, and the other not need PC support, and it also has FLASH repair, copy function.
A, U disk empty plate FLASH devices
the U disk FLASH empty plate working principle is to board a U disk and 48 PIN NAND FLASH feet with a welding 48_TSOP FLASH Application Block .relatively 48PIN Wire connectivity, this can be quick and simple detection or clear the FLASH Add TSOP-48 to contain, in the PC access time, PC to U disk to read the FLASH, if the FLASH is good, PC to U disk to read out the FLASH and find a removable disk, if the FLASH is bad, you can not identify FLASH. Can also correspond to the U disk upgrade tools to upgrade, low grid, clear operation. Used to empty the plane is designed to flash.
the U disk models are: Chipsbrand ChipsbankCBM2091, CBM2092, iCreate5128 program MXTronics core program of the times people MXT6208E (MXT8208) MXT6208 upgrade version, the UT165 master Sheng USBest program board, Taipower, PNY commonly used, such as U disk; Anguo (group wins) Alcor Anguo AU6981 program control PCB U plate to support the SLC and MLC flash memory, high-speed USB2.0 interface; Xin Chuang 3S (Solid State System) program SSS6677 control board, and prices high, Kingston U disk used has been to create USB-CDROM; Silicon Motion SMI program SM321QF board master disk U, Lenovo and other common U disk; superfamily Ameco program NW6208 micro program control program UDK2008 PCB U plate .
before FLASH clearance unprecedented Note:
1. The feet of NAND FLASH should not be cited solder adhesion, if the feet be cited solder adhesion it is one of the reasons why the flash is wrong.
2. FLASH keep clean because our rosin is insulated. Adhesions in our FLASH will also appear on the phenomenon of NO FLASH
3. To maintain the correct angle FLASH, do not have a skew, or we can also empty the FLASH does not correctly identify the FLASH.
4. If a clear sense of FLASH is not very flat feet, you can tap our Tweezers tail on both sides of FLASH, FLASH careful not to knock into the middle, so as to avoid damage to FLASH.
We FLASH on the icon to empty the browser's software usage.
1.open the Udisk upgrade tools
Summary of the use of
1. In the preparation of the FLASH Add some attention before the empty frame
(1) FLASH feet even tin. (2) whether or not to FLASH using plate washer clean water (3) FLASH pin is skewed, with a blade and correction
(2). We FLASH on the points (first leg) it is oriented to the good points PIN1
(3) FLASH foot is not flat. If you do not get tweezers formation FLASH2 side beat FLASH remember not to hit the middle of
(4) correct debugging
(5) We clear the grid and high-low cell
Low grid to choose the options are open OPTION settings ===== === strings === Product string will be selected at this time FLASH TEST =======
Burn-in test election is in the following election, or from low to high and then at the end of the election LOW LEVEL RORMAT If you have time, then put on the end of this election will not vote for this very format can also speed quickly 2-3 seconds in between RUN set up .then it will be ok.
NAND FLASH chip test board (FLASH-empty)
It is not a U disk test aircraft, then do not need connect to PC, It is an independent professional products. Automatic identification of a number of brand names FLASH chip, the original model, the capacity for clear operation at the same time, the number of test damage, damage to 0 for special tips, most of the characteristics of the test can be written into the chip's speed, accuracy 10uS, was tested to determine the accuracy of the chip level. Can not instantly identify LOGO white film and the names of the original model of capacity in 10 seconds to complete empty, is the scientific research, production, procurement chip to determine strengths and weaknesses, identifying counterfeit tablets and white film grinding tool.
Of the SLC and MLC device support FLASH chip specifications.
Seven brand support, multi-core and single-core chip FLASH.
It can support 4 wafer 16GB NAND flash;single yuan 4GB;double yuan NAND flash can be 16GB,but not support copy function.
Support NAND flash list:
1、Samsung all
2、hyundai all
3、Micron all
4、 Toshiba all
5、Infineon all
6、Hitachi, Renesas (COPY function does not open)
7、Hynix does not support
Enter: the right of the red button, click to begin the implementation of the designated function menu.
And then show the results of what will jump to the next screen display.
select key features: white keys on the left, click, sequential jump in the function menu.
Second, followed by the menu:
1, CHECK: Check make, model, the theoretical capacity
0 mark the first good and bad, good marker of capacity.
The first a wafer of the first pieces of bad location, bad blocks per thousand;
2nd wafer of the first pieces of bad location, bad points than the entire block;
3rd wafer of the first pieces of bad location, bad points than the entire block;
No. 4 wafer of the first pieces of bad location, bad points than the entire block;
2, ERASE: for deletion, report the results of operations
3, RESTORE: delete operation, and more difficult to read and write more comprehensive, the report speaks
For the results.
4, COPY: on the left side put the location of the original chip, the location of the right side of the goal put chip.
To carry out operations to remove and copy the contents of the original chip code to the target film.
Note: for a variety of Hitachi's NAND FLASH not support copy function.
Third, with regard to the traffic lights:
Green power that has the power to open
FLASH Block corresponding to the flashing red lights should be flashing at FLASH that the examination was normal, the red light
Testing will be out to complete.
If the red light Always on the seat of FLASH in question (not play good or bad film)
Fourth, the report of the results of operations of the format:
The first screen: G: No. If 0, show that: `0; 0 bad if the first show 0X; MB: General
The good capacity.
The second screen: 1: a wafer of the first pieces of bad location
%: The first wafer in a bad block thousands of hours than
If double-crystal, there will be the third screen
The third screen: 2: 2nd wafer bad block in the first place
%: 2nd wafer in a bad block thousands of hours than
If the crystal is 4 million, will be the third screen
Fourth screen: 3: 3rd wafer bad block in the first place
%: 3rd wafer in a bad block more than a thousand hours.
Fifth screen: 4: No. 4 wafer bad block in the first place
%: No. 4 wafer in a bad block thousands of hours than
Note:
1, the two chips of each of the test results of a screen and is shown at the same time.
2, the screen will show the first stop, and then click the red button to confirm it to the next screen, such as final
I also continue to screen button to confirm, will return to the function of the Office menu.
3, in the middle term of office by a choice of white button, it will return to the menu first.
Five on-board
1, FLASH folder is the seat of the General SDP-UNIT-48TS
2, the general SANSUNG, HYNIC, DT, INFINEAN, MICRO companies such as NAND
FLASH do not need to convert an additional plate.
Local using an external 5V power supply, then do not have a computer.
